? 2005 california micro devices corp. all rights reserved. 01/29/05 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 1 cm1451 preliminary lcd & camera emi filter array with esd protection features ? high bandwidth, high rf rejection filter array ? six channels of emi filtering ? utilizes praetorian ? inductor-based design tech- nology for true l-c filter implementation ? optiguard ? coating for improved reliability ? 15kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 30kv esd protection on each channel (hbm) ? better than 40db of attenuation at 1ghz ? chip scale package features extremely low lead inductance for optimum filter and esd performance ? 15-bump, 3.006mm x 1.376mm footprint chip scale package (cm1451-06cs/cp) ? lead-free version available applications ? lcd and camera data lines in mobile handsets ? i/o port protection for mobile handsets, notebook computers, pdas, etc. ? emi filtering for data phones in cell phones, pdas or notebook computerswireless handsets / cell phones ? wireless handsets ? handheld pcs/pdas ? lcd and camera modules product description the cm1451 is an inductor-capacitor (l-c) based emi filter array with integrated esd protection in csp form factor. the cm1451-06 is configured in a 6 channel format. each emi filter channel of the cm1451 is implemented as a 5-pole l-c filter where the compo- nent values are 10pf-17nh-10pf-17nf-10pf. the cm1451's roll-off frequency at -10db attenuation is 400mhz and can be used in applications where the data rates are as high as 120mbps while providing greater than 35db over the 800mhz to 2.7ghz fre- quency range. the parts integrate esd protection diodes on every pin, which provide a very high level of protection for sensitive elec tronic components that may be subjected to electrostatic discharge (esd). the esd protection diodes connec ted to the filter ports are designed and characterized to safely dissipate esd strikes of 15kv, beyond the level 4 requirement of the iec61000-4-2 international standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the pins are protected for contact discharges at greater than 30kv. this device is particularly well suited for portable elec- tronics (e.g. wireless handsets, pdas) because of its small package format and easy-to-use pin assign- ments. in particular, the cm1 451 is ideal for emi filter- ing and protecting data and control lines for the lcd display and camera interface in wireless handsets. the cm1451 incorporates optiguard ? which results in improved reliability at asse mbly. the cm1451 is avail- able in a space saving, low profile chip scale package with optional lead-free finishing. . electrical schematic * see package/pinout diagram 1 of 6 emi filtering + esd channels for expanded pin information. l1 c c filtern* gnd filtern* (pins b1-bn) c l2
? 2005 california micro devices corp. all rights reserved. 2 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 01/29/05 cm1451 preliminary ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices ar e specified by using a " + " character for the top side orientation mark. filter5 filter6 gnd filter5 filter6 a6 a5 orientation marking b3 c6 c5 filter3 filter4 gnd filter3 filter4 a4 a3 b2 c4 c3 filter1 filter2 gnd filter1 filter2 a2 a1 b1 c2 c1 a1 n516 4 3 26 5 1 c b a orientation marking (see note 2) package / pinout diagrams notes: bottom view cm1451-06cs/cp 15-bump csp package (bumps up view) top view (bumps down view) 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. pin descriptions pin(s) name description pin(s) name description a1 filter1 filter channel 1 c1 filter1 filter channel 1 a2 filter2 filter channel 2 c2 filter2 filter channel 2 a3 filter3 filter channel 3 c3 filter3 filter channel 3 a4 filter4 filter channel 4 c4 filter4 filter channel 4 a5 filter5 filter channel 5 c5 filter5 filter channel 5 a6 filter6 filter channel 6 c6 filter6 filter channel 6 b1-b3 gnd device ground part numbering information bumps package standard finish lead-free finish 2 ordering part number 1 part marking ordering part number 1 part marking 15 csp cm1451-06cs n516 CM1451-06CP n516
? 2005 california micro devices corp. all rights reserved. 01/29/05 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 3 cm1451 preliminary specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: clamping voltage is measured at t he opposite side of the emi filter to the esd pin. for example, if esd is applied to pi n a1, then clamping voltage is measured at pin c1. note 4: unused pins are left open note 5: these parameters are guaranteed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc power per resistor 100 mw dc package power rating 500 mw standard operating conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics (note 1) symbol parameter conditions min typ max units l tot total channel inductance (l 1 + l 2 )34nh l 1 , l 2 inductance 17 nh c tot total channel capacitance (c 1 + c 2 + c 3 ) at 2.5v dc, 1mhz, 30mv ac 24 30 36 pf c 1 , c 2 , c 3 capacitance at 2.5v dc, 1mhz, 30mv ac 810 12 pf f c cut-off frequency z source =50 ? , z load =50 ? 200 mhz f c roll-off frequency at -10db attenuation z source =50 ? , z load =50 ? 400 mhz v diode diode standoff voltage i diode =10 a5.5 v i leak diode leakage current (reverse bias) v diode =+ 3.3v 100 na v sig signal voltage positive clamp negative clamp i load = 10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd wi thstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2,4 and 5 30 15 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv positive transients negative transients notes 2,3,4 and 5 +12 -7 v v
? 2005 california micro devices corp. all rights reserved. 4 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 01/29/05 cm1451 preliminary performance information typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 1. insertion loss vs. frequency (a1-c1 to gnd b1) figure 2. filter capacitance vs. input voltage over temperature (normalized to capacitance at 2.5vdc and 25c)
? 2005 california micro devices corp. all rights reserved. 01/29/05 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 5 cm1451 preliminary performance information (cont?d) ac characteristics figure 3. 2ns rise and fall ti mes of signals clocked at 75mhz through cm1451 filter array (simulation) figure 4. 2ns rise and fall ti mes of signals clocked at 50mhz through cm1451 filter array (simulation)
? 2005 california micro devices corp. all rights reserved. 6 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 01/29/05 cm1451 preliminary performance information (cont?d) ac characteristics figure 5. 2ns rise and fall ti mes of signals clocked at 25mhz through cm1451 filter array (simulation)
? 2005 california micro devices corp. all rights reserved. 01/29/05 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 7 cm1451 preliminary application information refer to application note ap-217, "the chip scale package", for a detailed description of chip scale packages offered by ca lifornia micro devices. figure 6. recommended non-solder mask defined pad illustration figure 7. eutectic (snpb) solder ball reflow profile figure 8. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (las er cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous (183c) 60 seconds soldering maximum temperature 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2005 california micro devices corp. all rights reserved. 8 430 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 01/29/05 cm1451 preliminary mechanical details cm1450-06cs/cp csp mechanical specifications cm1451-06cs/cp devices are packaged in a custom chip scale package (csp). dimensions are presented below. for complete info rmation on csp packaging, see the california micro devices csp package infor- mation document. package dimensions for cm1451cs/cp chip scale package csp tape and reel specifications figure 9. tape and reel mechanical data package dimensions package custom csp bumps 15 dim millimeters inches min nom max min nom max a1 2.915 2.960 3.005 0.1148 0.1165 0.1183 a2 1.285 1.330 1.375 0.0506 0.0524 0.0541 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.0091 0.0110 d1 0.600 0.670 0.739 0.0236 0.0264 0.0291 d2 0.394 0.445 0.495 0.0155 0.0175 0.0195 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a b c 3456 c1 b1 a1 b3 c2 dimensions in millimeters d1 d2 a2 bottom view side view 12 b2 b4 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1451-06 2.96 x 1.33 x 0.6 3.10 x 1. 45 x 0.74 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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